TSMC to build €10B chip factory in Dresden, Germany
Taiwanese semiconductor manufacturer TSMC plans to construct a new production facility in Dresden, Germany, with an investment of at least EUR 10 billion. The plant will have a monthly capacity of 40,000 wafers, with construction starting in H2 2024 and operations by end of 2027. Bosch, Infineon and NXP will each hold a 10% stake.
Capacity
40,000 wafers per month
Products300-millimeter semiconductors
“With TSMC’s investment, a further global player in the semiconductor industry is coming to Germany.”gtai.de
- 4 sources
- gtai.deTSMC to Build Multi-Billion-Euro Chip Factory in Germany | Press Release | FDI | Semiconductor IndustryAug 7, 2023
- reuters.comBosch, Infineon, NXP, TSMC to establish JV for German wafer fabAug 8, 2023
- bloomberg.comTSMC to Build $11 Billion German Plant With Other Chipmakers - BloombergDebby Wu, Aggi CantrillAug 8, 2023
- semiconductor-digest.comTSMC to Build Multi-Billion-Euro Chip Factory in Germany - Semiconductor DigestShannon DavisAug 10, 2023
Summarized from public sources; check the original articles before acting on it.
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