Samsung Electronics to build HBM packaging fab in Onyang, South Korea

Samsung Electronics will hold a groundbreaking ceremony for a new HBM advanced packaging fab at its Onyang site in Asan, South Korea, investing approximately 1.3 trillion won. The facility will have a 31,000 sqm cleanroom and target mass production by May 2029.

“This marks a semiconductor speed-up campaign aimed at dispelling the AI bubble theory raised by some quarters.”mt.co.kr

• 1 source
• mt.co.kr[Exclusive] Samsung Chairman Lee Jae-yong to lead executives at HBM plant groundbreaking ceremony - MoneyTodayKim Ahyoung, JONGJIN PARKNov 5, 2026

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