Amkor to build $2B chip packaging plant in Peoria, Arizona
Amkor Technology will build a new advanced semiconductor packaging facility in Peoria, Arizona, with an investment of approximately $2 billion. Apple will be the first and largest customer of the facility, which will package Apple silicon produced at the nearby TSMC fab.
Capacity
500,000 square feet of clean room space
Productsadvanced semiconductor packagingsilicon packaging
“Apple is deeply committed to the future of American manufacturing, and we’ll continue to expand our investment here in the United States.”apple.com
- 4 sources
- apple.comApple announces expanded partnership with Amkor for silicon packaging - AppleNov 30, 2023
- ir.amkor.comAmkor Announces US Advanced Packaging and Test Facility | Amkor TechnologyNov 30, 2023
- reuters.comAmkor to build $2 billion Arizona semiconductor packaging plant | ReutersNov 30, 2023
- electronicsweekly.comAmkor to invest $2bn in Arizona packaging plant | Electronics WeeklyDavid MannersDec 1, 2023
Summarized from public sources; check the original articles before acting on it.
ENDATA