Infineon

TSMC, together with Bosch, Infineon, and NXP, held the groundbreaking ceremony for a new semiconductor fabrication plant (ESMC) in Dresden, Germany. The investment is approximately EUR 10 billion, making it the largest single corporate investment in Saxony since 1990.

German chipmaker Infineon agreed to buy Silicon Valley-based Cypress Semiconductor for $10 billion. The deal is on track to close by end of 2019 or early 2020.

Infineon, Germany's largest chip manufacturer, announced on 3 June 2019 it will acquire U.S. rival Cypress Semiconductor for approximately €9 billion ($10.1 billion), offering $23.85 per share.

Infineon is investing €1.6 billion in a new semiconductor factory in Villach, Austria, to produce power semiconductors on 300-mm thin wafers. Production is scheduled to start in early 2021, and the facility will include R&D space for about 600 experts.

Infineon has acquired Siltectra, a Dresden-based startup with Cold Split technology for processing crystal material, for €124 million. The technology will be used to split SiC wafers, doubling chip output per wafer.

Infineon and Philips won orders to supply security chips for new German passports issued from November 2005. Infineon will supply at least half of the chips to Bundesdruckerei GmbH.

Infineon is building a new production hall (Halle 17) in Regensburg, Germany, for €100 million to manufacture radar microchips for automotive applications, with production starting by the end of 2017.

Tongfu Microelectronics signed a strategic cooperation agreement with Infineon to build a smart factory. The gold bump packaging and testing project received support from the National Project 02.