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Samsung Electronics is preparing brownfield land at its Giheung campus for an estimated $18.7 billion advanced foundry fab to manufacture 2nm and 4nm logic chips. Initial construction work has begun under a framework contract with Samsung E&A, with structural handover scheduled for December 31, 2028.
“Samsung Electronics moved Nov. 4 to expand its contract chipmaking footprint, preparing brownfield land at its Giheung campus for an estimated $18.7 billion advanced foundry project.”eastasiabrief.com
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