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Tongfu Microelectronics' Intelligent Chip Packaging and Testing Project Phase II in Su-Xi-Tong Industrial Park began mass production on August 9, 2020. The facility has 240 sets of high-end equipment, 600 workers, and a monthly capacity of 60 million integrated circuits, with expected annual sales of 600 million yuan.
“On the morning of August 9, the project's Phase II officially began mass production, with an expected annual sales revenue of 600 million yuan once fully operational.”en.tfme.com
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