Tongfu Microelectronics partners with Infineon to build smart factory

Tongfu Microelectronics signed a strategic cooperation agreement with Infineon to build a smart factory. The gold bump packaging and testing project received support from the National Project 02.

“Signed a strategic cooperation agreement with Infineon to build a smart factory.”en.tfme.com

• 1 source
• en.tfme.com2017-Tongfu Microelectronics Co., Ltd.Mar 15, 2017

Summarized from public sources; check the original articles before acting on it.