Tongfu Microelectronics Co., Ltd.

Nantong Tongfu Microelectronics Co., Ltd. held a ceremony for the relocation of the first piece of equipment into the new Su-Tong Phase II factory building, marking the start of equipment installation for the expansion.

Tongfu Microelectronics is expanding its Hefei Phase I project, which currently produces 17 million integrated circuits per day. The Phase I project invested 3.3 billion RMB, and Phase II is planned with an additional 2.7 billion RMB investment.

Tongfu Microelectronics completed the exterior of its Phase 2 factory at the Nantong Sutong Industrial Park in Jiangsu, China. The Phase 2 project involves a total investment of 2 billion yuan ($297 million) and will apply advanced Fan-Out technology for high-end smart chip production. Interior construction is expected to be completed in the first half of 2019.

Tongfu Microelectronics signed a strategic cooperation agreement with the Haicang District government to jointly build an advanced integrated circuit packaging and testing production line in Xiamen, with a total investment of 7 billion yuan.

Tongfu Microelectronics signed a strategic cooperation agreement with Infineon to build a smart factory. The gold bump packaging and testing project received support from the National Project 02.