Tongfu Microelectronics completes Phase 2 factory shell at Nantong base

Tongfu Microelectronics completed the exterior of its Phase 2 factory at the Nantong Sutong Industrial Park in Jiangsu, China. The Phase 2 project involves a total investment of 2 billion yuan ($297 million) and will apply advanced Fan-Out technology for high-end smart chip production. Interior construction is expected to be completed in the first half of 2019.

“2기 프로젝트는 앞서 2017년 11월 18일 기초 공사를 완료한 이래 올해 상반기 중 공장 내부 건설까지 완료할 예정이다.”kipost.net

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• kipost.net中 패키징社 퉁푸마이크로, 2기 공장 건설 완료 < 아시아 < 기사본문 - KIPOST(키포스트)유효정 기자Feb 11, 2019

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