Tongfu Microelectronics expands Hefei IC packaging plant

Tongfu Microelectronics is expanding its Hefei Phase I project, which currently produces 17 million integrated circuits per day. The Phase I project invested 3.3 billion RMB, and Phase II is planned with an additional 2.7 billion RMB investment.

“目前一期项目每天的产能达到1700万颗集成电路，还在继续扩产。”xcc.com

• 1 source
• xcc.com一期项目日产1700万颗集成电路 通富微电合肥项目继续扩产Jul 1, 2019

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