Tongfu Microelectronics to build advanced IC packaging line in Xiamen

Tongfu Microelectronics signed a strategic cooperation agreement with the Haicang District government to jointly build an advanced integrated circuit packaging and testing production line in Xiamen, with a total investment of 7 billion yuan.

“The total investment for the Project will be 7 billion yuan, with plans to establish an industrialized base focusing on cutting-edge packaging and testing technologies.”en.tfme.com

• 1 source
• en.tfme.comSigning Ceremony of the Strategic Cooperation Agreement between Tongfu Microelectronics and the People's Government of Haicang District, Xiamen City-Tongfu Microelectronics Co., Ltd.Jun 26, 2017

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