Winbond to build $12B DRAM fab in Kaohsiung, Taiwan

Winbond Electronics Corp is building a new 12-inch DRAM fab in Kaohsiung, Taiwan, with a planned investment of NT$335 billion (US$12.08 billion) over 10 years. The fab is expected to begin small-volume production in July 2022 and regular production in October 2022, with a target capacity of 35,000 wafers per month.

“The Kaohsiung fab is set to produce a small volume of DRAM chips in July next year in preparation for regular production in October”taipeitimes.com

• 1 source
• taipeitimes.comWinbond to hire 400 engineers - Taipei TimesSep 2, 2021

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