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Winbond Electronics' board approved a plan to invest NT$20.37 billion (US$661 million) to build a 12-inch fab in Kaohsiung, Taiwan. Construction is to begin in Q4 2018 as part of a larger NT$335 billion capacity expansion scheme over 15 years.
“We are seeing demand from tier-one customers increasing faster for certain DRAM. That is one of the reasons that Winbond needs to build a new fab fast.”taipeitimes.com
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