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Winbond Electronics announced it will start building a new 12-inch wafer fab in Kaohsiung in September 2018, with an investment of NT$355 billion (US$11.9 billion). Equipment installation is slated for 2020, with production ramp-up to follow.
“Winbond is to start building a new fab in September to cope with promising demand for memory chips used in Internet of Things (IoT) applications, cars and big data collection and analysis.”taipeitimes.com
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