Winbond Electronics

Nuvoton Technology Corporation completed the acquisition of Panasonic Semiconductor Solutions Co., Ltd. and other assets from Panasonic entities for ¥31.2 billion (approximately $300 million). The deal includes assets in Japan, Singapore, and China.

Nuvoton Technology Corp agreed to acquire Panasonic's semiconductor solutions business for $250 million. The deal includes Panasonic's joint venture with Tower Semiconductor and is expected to close by June 2020.

Winbond Electronics Corp broke ground on a NT$335 billion (US$10.92 billion) 12-inch fab in Southern Taiwan Science Park, Kaohsiung, to produce DRAM and flash memory chips, creating at least 2,500 jobs.

Winbond Electronics' board approved a plan to invest NT$20.37 billion (US$661 million) to build a 12-inch fab in Kaohsiung, Taiwan. Construction is to begin in Q4 2018 as part of a larger NT$335 billion capacity expansion scheme over 15 years.

Winbond Electronics announced it will start building a new 12-inch wafer fab in Kaohsiung in September 2018, with an investment of NT$355 billion (US$11.9 billion). Equipment installation is slated for 2020, with production ramp-up to follow.

Winbond Electronics announced plans to build a NT$335 billion (US$11.14 billion) fab in Kaohsiung, Taiwan, to produce memory chips. The investment is expected to create over 1,000 jobs.