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Samsung Electronics breaks ground on HBM packaging line in Asan, South Korea · Endata

◂ Announcements

Nov 12, 2026NEW FACILITYAsan, South Chungcheong Province, South Korea

Samsung Electronics breaks ground on HBM packaging line in Asan, South Korea

Samsung Electronics held a groundbreaking ceremony for a new HBM packaging production line (Line 5) at its Onyang campus in Asan, South Chungcheong Province. The facility, part of a 144 trillion won investment by Samsung and affiliates, is scheduled to begin operations in June 2028.

Value

$45.1B (60000.0B KRW)

Jobs

700

Starts operating

Jun 2028

Status

Under construction

Capacity

31,000 m² cleanroom

ProductsHBM (high bandwidth memory) packaging

CompaniesSamsung Electronics

Sectors#Semiconductors and Industrial Electronics

“일반 반도체를 단순 조립·검사하는 공정이 중심이었던 이곳이 앞으로는 인공지능(AI) 반도체의 심장인 최첨단 HBM 거점으로 변모할 것”businesspost.co.kr

2 sources
businesspost.co.kr이재용 "온양캠퍼스를 AI 반도체 거점으로", 삼성 충청권에 144조 투자 | 비즈니스포스트Nov 12, 2026
koreatimes.co.krSamsung Electronics breaks ground on new HBM packaging facility in Asan - The Korea TimesLee Gyu-leeNov 12, 2026

Summarized from public sources; check the original articles before acting on it.

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