Samsung Electronics to invest $4.48B in HBM chip packaging plant in Asan, South Korea

Samsung Electronics is investing 6 trillion won ($4.48 billion) in a high-bandwidth memory (HBM) chip packaging plant in Asan, South Korea. The new HBM production line is scheduled to begin operations in June 2028, a year earlier than initially planned.

“The new HBM production line is scheduled to begin operations in June 2028, a year earlier than initially planned.”channelnewsasia.com

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• channelnewsasia.comSouth Korea's Lee says Samsung chip packaging expansion to spur $30 billion additional investment - CNANov 12, 2026

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