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ENDATA · Copyright (c) 2026 Endata · Data: CEPII BACI (Etalab 2.0), Federal Reserve G.17, U.S. BLS, Eurostat, World Bank (CC BY 4.0), GLEIF, SEC EDGAR; announcements summarized from the linked sourcesProspects Companies Sectors Announcements Countries

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Samsung plans $975M advanced packaging fab in Onyang, South Korea · Endata

◂ Announcements

Semiconductors and Industrial Electronicsworld trade 2024+6.8% 5Y CAGR

Nov 6, 2026NEW FACILITYOnyang, South Korea, South Korea

Samsung plans $975M advanced packaging fab in Onyang, South Korea

Samsung plans a $975 million advanced packaging fab in Onyang, South Korea, with a 31,000-square-meter cleanroom and mass production targeted for May 2029.

Value

$975.0M

Starts operating

May 2029

Status

Announced

Capacity

31,000-square-meter cleanroom

Productsadvanced packaging

CompaniesSamsung

Sectors#Semiconductors and Industrial Electronics

“Samsung also plans a $975M advanced packaging fab at Onyang, with a 31,000-square-meter cleanroom and mass production targeted for May 2029.”endata.com

1 source
endata.comDaily brief · EndataNov 6, 2026

Summarized from public sources; check the original articles before acting on it.

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