Samsung chip packaging expansion to spur $30B additional investment

South Korean President Lee Jae Myung stated that Samsung Electronics' 6 trillion won ($4.48 billion) investment in an HBM chip packaging plant in Asan will be followed by about 40 trillion won ($30 billion) in advanced equipment investment.

“Samsung Electronics’ 6 trillion won investment in a high-bandwidth memory chip packaging plant in Asan would be followed by about 40 trillion won in investment in advanced equipment.”investing.com

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• investing.comSouth Korea’s Lee says Samsung chip packaging expansion to spur $30 billion additional investment By ReutersNov 12, 2026

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