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Samsung Electro-Mechanics builds new plant for AI semiconductor substrates in Sejong · Endata

◂ Announcements

Nov 12, 2026NEW FACILITYSejong, South Korea

Samsung Electro-Mechanics builds new plant for AI semiconductor substrates in Sejong

Samsung Electro-Mechanics started construction of a new plant in Sejong to produce advanced semiconductor package substrates for AI applications, with an investment of 8 trillion won. Mass production is scheduled for September 2028.

Value

$6.02B (8000.0B KRW)

Starts operating

Sep 2028

Status

Under construction

ProductsAI semiconductor package substrates

CompaniesSamsung Electro-Mechanics

Sectors#Semiconductors and Industrial Electronics

“삼성전기는 세종 사업장에 8조 원을 투자해 AI용 첨단 반도체 패키지 기판 생산능력을 확대한다”businesspost.co.kr

1 source
businesspost.co.kr이재용 "온양캠퍼스를 AI 반도체 거점으로", 삼성 충청권에 144조 투자 | 비즈니스포스트Nov 12, 2026

Summarized from public sources; check the original articles before acting on it.

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Oct 6, 2026CONTRACTSouth Korea$18.1M
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