Advanced Semiconductor Engineering

Advanced Semiconductor Engineering Inc (ASE) is investing NT$12.5 billion (US$429 million) in a new advanced fab (K25) in Kaohsiung's Nanzih District to expand capacity for system-in-a-package (SiP) services. Production is expected to start in about two years.

ASE (Advanced Semiconductor Engineering) has agreed through its subsidiary J&R Holding Limited to purchase NXP's 40% stake in Suzhou Jih Yue Sun Semiconductor for $127 million, giving ASE full ownership. The transaction has been signed.

Advanced Semiconductor Engineering's unit Universal Global Electronics will invest $70.5 million to set up a Brazil-based joint venture with a Qualcomm unit to develop and manufacture integrated multi-component system-in-package modules for smartphones and IoT devices.

Qualcomm Technologies and Universal Scientific Industrial (USI) signed an agreement to form a joint venture to install a semiconductor module facility in São Paulo, Brazil, dedicated to designing and fabricating modules for smartphones and IoT devices. The agreement is subject to closing conditions.

Siliconware Precision Industries Co., Ltd. (SPIL) and Advanced Semiconductor Engineering, Inc. (ASE) plan to implement a joint share exchange to establish ASE Industrial Holding Co., Ltd., making both companies wholly-owned subsidiaries.

China's Ministry of Commerce conditionally cleared Advanced Semiconductor Engineering Inc.'s acquisition of Siliconware Precision Industries Co., Ltd. on 24 November 2017, requiring the parties to hold their businesses separate for 24 months.

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) received conditional approval from China's Anti-Monopoly Bureau for their combination, completing all necessary antitrust clearances. The establishment of ASE Industrial Holding Co., Ltd. is expected by end of May 2018.

Hanmi Semiconductor has signed a contract to supply semiconductor manufacturing equipment to Advanced Semiconductor Engineering (ASE) in Taiwan, valued at 930 million KRW. The contract period is from October 7 to October 20, 2017.

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have re-filed their merger application with China's Ministry of Commerce (MOFCOM) after withdrawing the previous filing. MOFCOM accepted the re-filing on June 6, 2017.

Advanced Semiconductor Engineering (ASE) received official confirmation from the US Federal Trade Commission that its investigation into the merger with Siliconware Precision Industries (SPIL) has been closed with no further action warranted. The merger, announced June 30, 2016, will create ASE Industrial Holding Co.

Qualcomm, ASE Group and the Brazilian government signed a memorandum of understanding to form a joint venture to build a high-capacity semiconductor factory in Brazil, with a planned investment of US$200 million.

Hanmi Semiconductor signed a contract worth KRW 4.51 billion to supply semiconductor manufacturing equipment to ASE Group (Advanced Semiconductor Engineering, Inc) in Taiwan.

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) announced that the Taiwan Fair Trade Commission cleared their merger on November 16, 2016. The merger involves a share exchange to form a new holding company.