IBIDEN Co., Ltd.

Ibiden announced a ¥180 billion capital investment to expand production capacity for IC package substrates at its Kawama plant in Ogaki, Gifu Prefecture, with partial rebuilding starting in 2021 and operations beginning in fiscal 2023.

IBIDEN announced a 60 billion yen investment to increase IC package substrate production capacity at its Ogaki Central Plant. Operations will start sequentially from end of 2020, with mass production beginning in FY21.

Ibiden plans to invest 75.5 billion yen in its electronics division (package substrates and printed wiring boards) in fiscal 2019, a record single-year amount, to increase production capacity for flip-chip package substrates.

DENSO Corporation and IBIDEN Co., Ltd. formed a capital and business alliance to jointly develop next-generation vehicle exhaust systems, combining DENSO's systems expertise with IBIDEN's ceramic materials.