IBIDEN invests 60 billion yen to increase IC package substrate capacity

IBIDEN announced a 60 billion yen investment to increase IC package substrate production capacity at its Ogaki Central Plant. Operations will start sequentially from end of 2020, with mass production beginning in FY21.

“IBIDEN announced on April 27, 2020 that it will increase its IC package substrate production capacity at the Ogaki Central Plant.”seisanzai-japan.com

• 1 source
• seisanzai-japan.comIBIDEN invests 60 billion yen to increase the production capacity of IC package substrates | Industry and Manufacturing News Archive | SEISANZAI JapanApr 30, 2020

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