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VIS and NXP to build $7.8B 300mm wafer fab in Singapore · Endata

◂ Announcements

Jun 5, 2024NEW FACILITYSingapore, Singapore

VIS and NXP to build $7.8B 300mm wafer fab in Singapore

Vanguard International Semiconductor (VIS) and NXP Semiconductors announced a joint venture, VisionPower Semiconductor Manufacturing Company (VSMC), to build a new 300mm semiconductor wafer fab in Singapore. The initial phase will cost $7.8 billion and is expected to begin production in 2027.

Value

$7.80B

Jobs

1,500

Starts operating

2027

Status

Announced

Capacity

55,000 300mm wafers per month

Products130nm to 40nm mixed-signal, power management and analog products

CompaniesVanguard International Semiconductor NXP Semiconductors partner VisionPower Semiconductor Manufacturing Company partner

Sectors#Semiconductors and Industrial Electronics

“The joint venture will begin construction of the initial phase of the wafer fab in the second half of 2024, pending receipt of all required regulatory approvals, with initial production available to customers during 2027.”investors.nxp.com

2 sources
investors.nxp.comVIS and NXP to Establish a Joint Venture to Build and Operate a 300mm Fab | NXP SemiconductorsJun 5, 2024
forbes.comTSMC-Backed Vanguard To Build $7.8 Billion Chip Plant In SingaporeIan SaysonJun 5, 2024

Summarized from public sources; check the original articles before acting on it.

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