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Micron breaks ground on $7B HBM advanced packaging facility in Singapore · Endata

◂ Announcements

Jan 8, 2025NEW FACILITYSingapore, Singapore

Micron breaks ground on $7B HBM advanced packaging facility in Singapore

Micron Technology broke ground on a new High-Bandwidth Memory advanced packaging facility in Singapore, with an investment of approximately $7 billion. Operations are scheduled to begin in 2026, with capacity expansion starting in 2027, creating around 1,400 jobs initially.

Value

$7.00B

Jobs

1,400

Starts operating

2026

Status

Under construction

ProductsHigh-Bandwidth Memory (HBM) advanced packaging

CompaniesMicron Technology

Sectors#Semiconductors and Industrial Electronics

“As AI adoption proliferates across industries, the demand for advanced memory and storage solutions will continue to increase robustly.”micron.gcs-web.com

2 sources
micron.gcs-web.comMicron Breaks Ground on New HBM Advanced Packaging Facility in Singapore | Micron TechnologyJan 8, 2025
manufacturing.economictimes.indiatimes.comMicron Technology: Micron to invest $7 bn in S'pore memory chip plant, ETManufacturingJan 9, 2025

Summarized from public sources; check the original articles before acting on it.

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