United Microelectronics Corporation

United Microelectronics Corporation (UMC) received final approval and completed the full acquisition of Mie Fujitsu Semiconductor Limited (MIFS), a 300mm wafer foundry joint venture.

United Microelectronics Corporation officially unveiled its new fab facility in Singapore, a greenfield expansion adjacent to its existing fab. The first phase will start volume production in 2026, creating approximately 700 new jobs.

United Microelectronics Corp (UMC) approved a capital spending budget of NT$27.41 billion (US$887.6 million) to boost 12-inch and 8-inch wafer capacities in Taiwan, Singapore and Xiamen, China. The Xiamen fab will increase monthly capacity to 25,000 wafers, and the Hejian Technology fab in Suzhou to 75,000 wafers per month.

United Microelectronics Corporation announced it will suspend R&D assistance to Fujian Jinhua Integrated Circuit.

Allegro MicroSystems has signed a long-term deal with United Microelectronics (UMC) under which UMC will remain Allegro's primary contract chipmaker.

Allegro MicroSystems and United Microelectronics Corporation (UMC) signed a long-term agreement for UMC to continue as Allegro's primary foundry wafer manufacturer, covering technical collaboration and capacity for Allegro's automotive-grade technologies.

United Microelectronics Corporation (UMC) announced its Board of Directors approved the full acquisition of Mie Fujitsu Semiconductor Limited (MIFS), a 12-inch wafer foundry in Mie, Japan, from Fujitsu Semiconductor. UMC currently owns 15.9% of MIFS and will acquire the remaining 84.1% for no more than ¥57.63 billion.

United Microelectronics Corporation (UMC) will acquire the remaining 84.1% of Mie Fujitsu Semiconductor Limited (MIFS) from Fujitsu Semiconductor for approximately JPY 57.6 billion, making MIFS a wholly-owned subsidiary. The transfer is planned for January 1, 2019.

United Microelectronics Corp (UMC) received regulatory approval to invest an additional US$600 million in its joint 12-inch fab in Xiamen, China, to expand production capacity. Monthly capacity is expected to rise to 16,000 wafers in Q2 2018.

Panasonic Semiconductor Solutions and United Microelectronics Corporation agreed to jointly develop a mass production process for next-generation 40nm ReRAM. Product samples are expected to ship in 2018.

Panasonic is partnering with United Microelectronics Corp. to develop and mass-produce a power-saving version of resistive random access memory (ReRAM) for wearables.

UMC held the grand opening of United Semi, its 12-inch joint venture wafer fab in Xiamen, China. The fab has achieved volume production on 40nm process and has a maximum design capacity of 50,000 wafers per month.