Tongfu Microelectronics signs long-term packaging and testing deal with AMD

Tongfu Microelectronics has formed a strategic partnership with AMD and signed a long-term business agreement to provide packaging and testing services for AI, PC chips and AI accelerators. Tongfu is now AMD's largest packaging and testing supplier.

“Tongfu Microelectronics, a semiconductor packaging and testing company in mainland China, recently revealed in an interview that it has formed a close strategic partnership with AMD and signed a long-term business agreement to provide AMD with packaging and testing services for AI, PC chips and AI a”semimedia.cc

• 1 source
• semimedia.ccTongfu becomes AMD’s largest packaging and testing supplier - SemiMediaSemiMediaEditFeb 21, 2024

Summarized from public sources; check the original articles before acting on it.