Tongfu Microelectronics starts third-phase chip packaging project in Nantong

Tongfu Microelectronics (通富微电) began construction of its third-phase intelligent chip packaging and testing project in Nantong, China. The project will add production capacity of 1.5 billion IC products and 100,000 wafers per year.

“通富微电三期智能芯片封测项目总建筑面积达9.54万平米，项目达成后，将形成不低于年产集成电路产品15亿片、晶圆级封装10万片的生产能力。”sohu.com

• 1 source
• sohu.com通富微电三期工程开工，未来形成晶圆级封装10万片的生产能力_南通Jan 15, 2021

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