Tongfu Microelectronics mass-produces Chiplet chips for AMD

Tongfu Microelectronics announced it has mass-produced chiplet products for AMD using advanced packaging technologies. The company is AMD's largest packaging and testing supplier, accounting for over 80% of its orders.

“The company has adopted multi-chip components and integrated fan-out packaging, 2.5D/3D and other advanced packaging technologies, it can provide customers with diversified chiplet packaging solutions, and has mass-produced chiplet products for AMD.”sensor360.org

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• sensor360.orgWinning 80% of orders, domestic packaging and testing factory Tongfu Microelectronics said it has mass-produced Chiplet chips for AMD - Sensor360Sense of mediaFeb 17, 2023

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