Silan Microelectronics plans 6.5 billion yuan investment in chip and SiC projects

Silan Microelectronics (士兰微) announced a non-public share issuance plan to raise up to 6.5 billion yuan for three projects: a 12-inch wafer production line (360,000 wafers/year), a SiC power device production line (144,000 wafers/year), and an automotive semiconductor packaging project (7.2 million modules/year). The application was accepted by the Shanghai Stock Exchange on March 1, 2023.

“The project's implementation will help improve the company's supply guarantee capability and customer supply chain security.”seccw.com

• 1 source
• seccw.com士兰微65亿元定增申请获上交所受理 发力SiC功率器件等领域Mar 9, 2023

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