Silan Micro plans to raise CNY6.5B for auto chip expansion

Silan Microelectronics aims to raise CNY6.5 billion (USD903 million) in a private placement to fund three projects: a new 12-inch power chip plant in Hangzhou (CNY3 billion), expansion of SiC chip capacity in Xiamen (CNY750 million), and a semiconductor packaging plant in Chengdu (CNY1.1 billion). Each project is expected to take three years.

“This is one of the company’s core strategic plans in the field of high-end power semiconductors.”yicaiglobal.com

• 1 source
• yicaiglobal.comChina’s Silan Micro Plans to Raise USD903 Million to Fund Auto Chip ExpansionTang ShihuaOct 17, 2022

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