Silan Microelectronics

Silan Microelectronics and the National Integrated Circuit Industry Investment Fund (Big Fund) will jointly invest 800 million yuan to increase the registered capital of subsidiary Silan Jixin for the second-phase 8-inch chip production line project. The total project investment is 1.5 billion yuan.

Silan Microelectronics (Silan) announced a 1.5 billion yuan ($210 million) investment to expand capacity at its 8-inch wafer fab in Hangzhou, China, through its subsidiary Silan Jixin. The project will add 432,000 8-inch wafers per year over five years, with partial funding from a 800 million yuan capital increase by Silan and the National Integrated Circuit Industry Investment Fund.

Silan Microelectronics is accelerating construction of a 12-inch specialty process chip manufacturing line and a compound semiconductor line in Xiamen, with trial production planned for Q4 2019 and 2020 respectively. Total investment is 22 billion yuan.

Silan Microelectronics and Xiamen Semiconductor Investment Group will invest a total of CNY 22 billion to build two 12-inch wafer fabs and one advanced compound semiconductor line in Xiamen's Haicang district. The 12-inch fab project is valued at CNY 17 billion and the compound semiconductor project at CNY 5 billion.