Xiamen Semiconductor Investment Group

TTM Technologies agreed to divest its four China manufacturing plants comprising substantially all assets of its Mobility business unit to AKMMeadville Electronics for $550 million in cash.

Chinese semiconductor company Silan, in a joint venture with Xiamen Semiconductor Investment Group, is building a 12-inch specialty semiconductor fab in Xiamen's Haicang district. Total investment is 22 billion yuan, with Phase 1 already started in October 2018.

Silan Electronics and Xiamen Semiconductor Investment Group officially started construction of two 12-inch specialty process chip production lines and a 4-6-inch advanced compound semiconductor production line in Xiamen, China, with a total investment of approximately USD 3.18 billion.

Silan Microelectronics and Xiamen Semiconductor Investment Group will jointly invest CNY5 billion (USD756 million) to build a 4/6-inch compatible advanced compound semiconductor device production line in Haicang district, Xiamen, China. Products include optical communication module chips, 5G and RF modules, and high-end LED chips.

Hangzhou Silan Microelectronics will invest CNY17 billion (USD2.6 billion) to build two 12-inch integrated circuit production lines in Haicang district, Xiamen, China. The first line will have a capacity of 80,000 wafers per month.

Silan Microelectronics and Xiamen Semiconductor Investment Group will invest a total of CNY 22 billion to build two 12-inch wafer fabs and one advanced compound semiconductor line in Xiamen's Haicang district. The 12-inch fab project is valued at CNY 17 billion and the compound semiconductor project at CNY 5 billion.