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Ibiden to build IC package substrate plant in Ogaki, Japan · Endata

◂ Announcements

Jun 3, 2022NEW FACILITYOgaki, Gifu Prefecture, Japan

Ibiden to build IC package substrate plant in Ogaki, Japan

Ibiden held a groundbreaking ceremony for a new building at its Kawama site in Ogaki, Gifu Prefecture, to produce high-performance IC package substrates. Total investment is 180 billion yen, with completion scheduled for the second half of fiscal 2023.

Value

$1.38B (180.0B JPY)

Starts operating

Q4 2023

Status

Under construction

Productshigh-performance IC package substrates

CompaniesIBIDEN Co., Ltd.

Sectors#Semiconductors and Industrial Electronics

“総投資額は1800億円で、スマートファクトリーとして2023年度下期に竣工予定となっています。”automation-news.jp

1 source
automation-news.jpイビデン、岐阜県大垣市のICパッケージ基板生産新棟建設の起工式実施 – オートメーション新聞WEB／AutomationNewsJun 3, 2022

Summarized from public sources; check the original articles before acting on it.

More from IBIDEN Co., Ltd.

Jan 6, 2023INVESTMENTŌno, Gifu Prefecture, Japan$1.90B
Ibiden to invest ¥250 billion in semiconductor materials plant
IBIDEN Co., Ltd.nikkei.com
Dec 16, 2022ACQUISITIONBeijing, China$125.0M
Fastprint Technology to acquire 100% of Beijing Ibiden for ¥870M
IBIDEN Co., Ltd. partner Fastprint Technology (Shenzhen) acquirer news.qq.com
Apr 1, 2022EXPANSIONKawama plant, Japanops Q4 2023
Ibiden holds groundbreaking for new building at Kawama plant for IC package substrates
IBIDEN Co., Ltd.ibiden.co.jp
Apr 27, 2021EXPANSIONOgaki, Gifu Prefecture, Japan$1.65Bops 2023
Ibiden to invest ¥180 billion in IC substrate plant in Ogaki
IBIDEN Co., Ltd.chunichi.co.jp digitimes.com
Apr 27, 2020INVESTMENTOgaki, Japan$560.0Mops 2021
IBIDEN invests 60 billion yen to increase IC package substrate capacity
IBIDEN Co., Ltd.seisanzai-japan.com
May 28, 2019INVESTMENTOgaki, Gifu Prefecture, Japan, Japan$690.0Mops Q1 2020
Ibiden plans record JPY 75.5 billion investment in package substrates
IBIDEN Co., Ltd.news.infoseek.co.jp

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