Ibiden holds groundbreaking for new building at Kawama plant for IC package substrates

Ibiden Co., Ltd. held a groundbreaking ceremony on April 15, 2022, for a new building at its Kawama plant to increase production capacity for high-performance IC package substrates. The building is scheduled for completion in the second half of fiscal year 2023.

“2022年4月15日に新棟建設の起工式を行いましたので、お知らせいたします。”ibiden.co.jp

• 1 source
• ibiden.co.jp高機能ICパッケージ基板向け 河間事業場新棟建設の起工式を実施｜企業情報ニュース｜企業情報｜イビデン株式会社（日本語）Apr 1, 2022

Summarized from public sources; check the original articles before acting on it.