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Soilbuild Group is constructing a building at Kallang Way, Singapore, to house RF360, a joint venture between Qualcomm and TDK. RF360 is committing S$500 million and Soilbuild over S$110 million. The facility is expected to be completed in June 2019 and will create 300 new jobs.
“RF360 said that it is expanding to capture the strong demand growth in the radio frequency application market, and is committing S$500 million to the custom-built site.”straitstimes.com
Summarized from public sources; check the original articles before acting on it.