RF360 Holdings

Soilbuild Group is constructing a building at Kallang Way, Singapore, to house RF360, a joint venture between Qualcomm and TDK. RF360 is committing S$500 million and Soilbuild over S$110 million. The facility is expected to be completed in June 2019 and will create 300 new jobs.

Qualcomm and TDK announced a joint venture, RF360 Holdings, to develop fully integrated RF front-end modules and filters. Qualcomm will hold 51% and TDK 49%, with a total estimated transaction value of USD 3 billion.

Qualcomm and TDK completed the formation of joint venture RF360 Holdings Singapore Pte Ltd to develop and manufacture radio-frequency front-end filtering solutions. The JV has over 4,000 staff.

Qualcomm has reached an agreement to acquire NXP Semiconductors for $37.3 billion, creating a major semiconductor company. The deal is expected to close soon.