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Soilbuild Group is constructing a building at Kallang Way, Singapore, to house RF360, a joint venture between Qualcomm and TDK. RF360 is committing S$500 million and Soilbuild over S$110 million. The facility is expected to be completed in June 2019 and will create 300 new jobs.
| Site | Largest | Latest |
|---|---|---|
| Kallang Way, Singapore | $450.0M | 2017-11-29 |