Ibiden approves JPY 500 billion capital investment for IC package substrate capacity

Ibiden Co., Ltd. announced a capital investment plan of approximately JPY 500 billion over fiscal years 2026-2028 to expand production capacity for high-performance IC package substrates, primarily for AI servers. The first phase includes JPY 220 billion for the Gama Plant and other sites, with mass production starting from fiscal year 2027.

“Ibiden Co.,Ltd. announced that the Board of Directors... resolved to approve a capital investment plan for its electronics business, amounting to approximately JPY 500 billion over the three-year period from fiscal year 2026 to fiscal year 2028”marketscreener.com

• 2 sources
• marketscreener.comIbiden Co.,Ltd. Announces Capital Investment Plan for Expansion of Production Capacity | MarketScreenerS&P Capital IQFeb 3, 2026
• japanir.jpIbiden Co., Ltd. Approves Approximately 500 Billion Yen Capital Investment for High-Performance IC Package Substrates | Japan IRFeb 3, 2026

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