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TOPPAN Holdings will invest 40 billion yen in a plant in Ishikawa Prefecture (former JOLED facility) to mass-produce next-generation semiconductor packages, with test equipment installation by end of 2025 and mass production targeted for fiscal 2030. Additionally, 30 billion yen will be invested in a Niigata plant to increase production of current semiconductor materials.
“年内に試験製造設備を設置し、2030年度の量産を目指す。”nikkei.com
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