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Ibiden announced that its new semiconductor package substrate plant under construction in Ōno, Gifu Prefecture, has been certified under Japan's economic security law, qualifying for up to 40.5 billion yen in government subsidies. The plant is expected to start supply in Q3 FY2025 and will increase production capacity by 12%.
“イビデンは28日、岐阜県大野町に建設中の半導体パッケージ基板の新工場に政府から最大405億円の助成金が交付される予定になったと発表した。”nikkei.com
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