EV Group

Activity by year

20192020202120222023202420252026

ExpansionPartnership

Jan 29, 2021PARTNERSHIP
ASM Pacific Technology and EV Group partner on die-to-wafer hybrid bonding
ASM Pacific Technology and EV Group signed a joint development agreement on 29 January 2021 to co-develop die-to-wafer hybrid bonding solutions for 3D-IC/heterogeneous integration applications.
ASM Pacific Technology partner EV Group partner #Semiconductors and Industrial Electronics evgroup.com
Jun 24, 2019EXPANSIONSt. Florian am Inn, Austria$34.0M
EV Group invests €30 million in cleanroom expansion at Austrian headquarters
EV Group (EVG) began construction of a new Cleanroom V building at its corporate headquarters in St. Florian am Inn, Austria, with an investment of €30 million. The facility will add capacity for product development, demonstrations, and pilot production.
EV Group #Semiconductors and Industrial Electronics evgroup.com

Site	Largest	Latest
St. Florian am Inn, Austria	$34.0M	2019-06-24

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