ASM Pacific Technology and EV Group partner on die-to-wafer hybrid bonding

ASM Pacific Technology and EV Group signed a joint development agreement on 29 January 2021 to co-develop die-to-wafer hybrid bonding solutions for 3D-IC/heterogeneous integration applications.

“Die-to-wafer hybrid bonding is a pivotal process for enabling the redesign of system-on-chip (SoC) devices to 3D stacked chips via chiplet technology”evgroup.com

• 1 source
• evgroup.comASM Pacific Technology and EV Group Join Forces to Enable Industry’s First Ultra Precision Die-to-Wafer Hybrid Bonding Solutions for 3D-IC Heterogeneous IntegrationJan 29, 2021

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