ASM Pacific Technology

ASM Pacific Technology and EV Group signed a joint development agreement on 29 January 2021 to co-develop die-to-wafer hybrid bonding solutions for 3D-IC/heterogeneous integration applications.

ASMPT announced an agreement to form a strategic joint venture involving its Materials segment with Wise Road Capital and Asia-IO Capital Management. ASMPT will hold a 44.44% minority stake, while the partners will hold 55.56%.

ASM Pacific Technology Ltd. (ASMPT) completed its acquisition of TEL NEXX, Inc from Tokyo Electron Limited on 1 October 2018. TEL NEXX will be subsumed under the Back-End Equipment segment of ASMPT.

ASM Pacific Technology Ltd. signed a definitive agreement with Tokyo Electron Limited to acquire TEL NEXX, Inc., an industry leader in Electrochemical Deposition and Physical Vapor Deposition technologies for the advanced packaging market. The deal is expected to close upon regulatory approvals.

ASM Pacific Technology, through its subsidiary ASM Technology Singapore, has agreed to acquire all shares of AMICRA Microtechnologies GmbH, a German supplier of ultra-high precision die attach equipment.

ASM Pacific Technology (ASMPT) announced the opening of a Research & Development Center in Taiwan. The center will focus on software development for Industry 4.0 and smart factory solutions, and is part of the company's $180 million annual investment in technology research.