Hangzhou Silan Microelectronics

Hangzhou Silan Microelectronics will invest CNY1.5 billion (USD210 million) to expand its eight-inch integrated circuit production line, with CNY500 million from a state industrial fund. The project will be built in two phases over five years, targeting annual output of 252,000 eight-inch ICs in phase two.

Silan Microelectronics and Xiamen Semiconductor Investment Group will jointly invest CNY5 billion (USD756 million) to build a 4/6-inch compatible advanced compound semiconductor device production line in Haicang district, Xiamen, China. Products include optical communication module chips, 5G and RF modules, and high-end LED chips.

Hangzhou Silan Microelectronics will invest CNY17 billion (USD2.6 billion) to build two 12-inch integrated circuit production lines in Haicang district, Xiamen, China. The first line will have a capacity of 80,000 wafers per month.