Silan Microelectronics and the National Integrated Circuit Industry Investment Fund (Big Fund) will jointly invest 800 million yuan to increase the registered capital of subsidiary Silan Jixin for the second-phase 8-inch chip production line project. The total project investment is 1.5 billion yuan.
Silan Microelectronics (Silan) announced a 1.5 billion yuan ($210 million) investment to expand capacity at its 8-inch wafer fab in Hangzhou, China, through its subsidiary Silan Jixin. The project will add 432,000 8-inch wafers per year over five years, with partial funding from a 800 million yuan capital increase by Silan and the National Integrated Circuit Industry Investment Fund.
Hangzhou Silan Microelectronics will invest CNY1.5 billion (USD210 million) to expand its eight-inch integrated circuit production line, with CNY500 million from a state industrial fund. The project will be built in two phases over five years, targeting annual output of 252,000 eight-inch ICs in phase two.
Fastprint Circuit Tech signed an agreement to build an integrated circuit substrate plant in Guangzhou for about CNY 3 billion (USD 436.2 million), with investment in two phases.
Hua Hong Semiconductor issued shares to National Integrated Circuit Industry Investment Fund for net proceeds of about $400 million, and together with other parties, will inject a total of $18 billion into its Wuxi subsidiary for a 12-inch wafer fab.