Silan and Xiamen Semiconductor to build compound semiconductor line in Xiamen

Silan Microelectronics and Xiamen Semiconductor Investment Group will jointly invest CNY5 billion (USD756 million) to build a 4/6-inch compatible advanced compound semiconductor device production line in Haicang district, Xiamen, China. Products include optical communication module chips, 5G and RF modules, and high-end LED chips.

“The company will also jointly invest CNY5 billion (USD756 million) together with Xiamen Semiconductor Investment Group Co. to build a 4/6-inch compatible advanced compound semiconductor device production line in Haicang district.”www2.yicaiglobal.com

• 1 source
• www2.yicaiglobal.comSilan, Local Chinese Government Will Jointly Invest USD2.6 Billion in SE China Integrated Circuit ProjectTang ShihuaDec 19, 2017

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