Tsinghua Unigroup

Chinese chipmaker Tsinghua Unigroup snapped up French component-maker Linxens with a majority interest at 18 billion yuan.

Phison Electronics signed a MoU with Beijing Unis Memory Technology, a Tsinghua Unigroup subsidiary, to establish a strategic partnership in the storage device market. Phison will provide one-stop services from chip design to contract manufacturing.

ASE Technology Holding Co agreed to sell a 30% stake in its Suzhou subsidiary, Suzhou ASEN Semiconductors Co, to Tsinghua Unigroup Ltd for about US$95.33 million.

Chinese chip maker Tsinghua Unigroup has signed a deal to acquire French smart chip components maker Linxens from CVC for about €2.2 billion ($2.6 billion). The deal is pending regulatory clearance.

A group led by Tsinghua Unigroup will build a 60 billion-yuan ($9.5 billion) integrated circuit design and manufacturing facility in Chongqing, China. The facility will focus on seven types of cutting-edge chips and could absorb up to $100 billion in investment over 10 years.

Tsinghua Unigroup and Unis Technology collectively bought a 7% stake in Germany's Dialog Semiconductor, crossing the disclosure threshold on November 30, 2017. The stake is valued at about €126 million.

Tsinghua Unigroup signed a strategic cooperation agreement with the Bank of Nanjing to build a $30 billion factory producing DRAM and 3D NAND memory chips. Phase 1 capacity is 100,000 wafers per month, with Phase 2 doubling that.

Tsinghua Unigroup and China Integrated Circuit Investment Fund completed the structure of a national memory chip plant in Wuhan ahead of schedule after nine months of construction. The plant is expected to begin operations in 2018 with a monthly capacity of 300,000 units and annual output value over USD 10 billion.

Tsinghua Unigroup broke ground for a memory plant in Nanjing, China, to manufacture 3D NAND flash and DRAM chips. The two-phase project has a total investment of about US$30 billion, with phase one expected to be completed by 2019.

Tsinghua Unigroup Ltd, through its subsidiary Spreadtrum RDA, is teaming up with Britain's Dialog Semiconductor Plc to develop smartphone chips. They are considering a joint venture in eastern China to jointly design communications components.

Dialog Semiconductor Plc. and Tsinghua Unigroup Ltd.'s subsidiary Spreadtrum & RDA are considering a joint venture in eastern China to jointly design communications components for smartphones and IoT.

Tsinghua Unigroup plans two more semiconductor fabrication plants near Chengdu and Nanjing, as part of a total $70 billion investment in three fabs.

Tsinghua Unigroup announced plans to build a flash memory fabrication plant near Wuhan, China, costing $24 billion. The fab is expected to produce 300,000 wafers per month starting in 2020.

Yangtze Memory Technologies Co. (YMTC), backed by Tsinghua Unigroup and others, broke ground on a national memory base project in Wuhan, China, with a total investment of $24 billion. The facility will produce 3D NAND flash memory, with initial production expected in 2018 and full completion by 2020.

ChipMOS Technologies and Tsinghua Unigroup announced an agreement to form a joint venture and mutually terminate Tsinghua Unigroup's earlier investment.

ChipMOS and Tsinghua Unigroup agreed to form a joint venture where Tsinghua Unigroup will acquire 48% of ChipMOS Shanghai for approximately RMB 498.4 million (US$77 million), with ChipMOS retaining 45.02%. The investment will expand capacity and services.