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A group led by Tsinghua Unigroup will build a 60 billion-yuan ($9.5 billion) integrated circuit design and manufacturing facility in Chongqing, China. The facility will focus on seven types of cutting-edge chips and could absorb up to $100 billion in investment over 10 years.
Tsinghua Unigroup broke ground for a memory plant in Nanjing, China, to manufacture 3D NAND flash and DRAM chips. The two-phase project has a total investment of about US$30 billion, with phase one expected to be completed by 2019.