ChipMOS and Tsinghua Unigroup agree to form joint venture

ChipMOS Technologies and Tsinghua Unigroup announced an agreement to form a joint venture and mutually terminate Tsinghua Unigroup's earlier investment.

“ChipMOS TECHNOLOGIES INC. and Tsinghua Unigroup Ltd. announced an agreement to form a joint-venture and to mutually terminate Tsinghua Unigroup's earlier ...”semiconductorpackagingnews.com

• 1 source
• semiconductorpackagingnews.comChipMOS and Tsinghua Unigroup Agree to Form Joint-VentureDec 6, 2016

Summarized from public sources; check the original articles before acting on it.